Low Temperature Bonding Process Using Cu Nanoparticles and Mixed Ag-Cu Nanoparticles
نویسندگان
چکیده
منابع مشابه
Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2010
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.13.536